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GIGABYTE B560M AORUS PRO AX Wi-Fi Intel 10th and 11th Gen ATX Motherboard

GIGABYTE B560M AORUS PRO AX Wi-Fi Intel 10th and 11th Gen ATX Motherboard

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BDT TBABDT 00 % off
  • Product CodeGM - 17354
  • Delivery time3-5 days
  • AvailabiltyOut of Stock

Descriptions

Specification

Basic Information
Supported CPU11th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors
10th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors / Intel Core i3 processors/ Intel Pentium processors / Intel Celeron processors
L3 cache varies with CPU
ChipsetIntel B560 Express Chipset
BIOS1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Form FactorMicro ATX Form Factor; 24.4cm x 24.4cm
Expansion Slots
PCI1 x PCI Express x16 slot, running at x16 (PCIEX16)
1 x PCI Express x16 slot, running at x4 (PCIEX4)
1 x PCI Express x1 slot
M.2 Socket1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)
1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB)
Memory
TypeDDR4
Slots4 x DIMM
Supported Memory11th Generation Intel Core i9/ i7/ i5 processors:
Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/ DDR4 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules
10th Generation Intel Core i9/ i7 processors:
Support for DDR4 2933/ 2666/ 2400/ 2133 MHz memory modules
10th Generation Intel Core i5/ i3 /Pentium/Celeron processors:
Support for DDR4 2666/2400/2133 MHz memory modules
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/ 2Rx8/ 1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
Maximum Memory128 GB (32 GB single DIMM capacity)
Graphics
GraphicsIntegrated Graphics Processor-Intel® HD Graphics support:
1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz
1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies
Connector & Ports
HDMI1 x HDMI port, supporting a maximum resolution of 4096 x 2160@30 Hz
Display Port (s)1 x DisplayPort, supporting a maximum resolution of 4096 x 2304@60 Hz
USB (s)1 x USB Type-C port on the back panel, with USB 3.2 Gen2x2 support
1 x USB 3.2 Gen2 Type-A ports (red) on the back panel
2 x USB 3.2 Gen1 ports on the back panel
2 x USB 2.0/1.1 ports on the back panel
Chipset+USB 3.2 Gen 1 Hub:
1 x USB Type-C port with USB 3.2 Gen1 support, available through the internal USB header
2 x USB 3.2 Gen1 ports available through the internal USB header
Chipset+ 2 USB 2.0 Hubs:
8 x USB 2.0/ 1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
LAN Port (s)Intel 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)
Supported Storage1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)
Chipset:
1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB)
6 x SATA 6Gb/s connectors
Intel Optane Memory Ready
AudioRealtek Audio codec
High Definition Audio
2/4/5.1/7.1-channel
Internal I/O Ports1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x water cooling CPU fan header
3 x system fan headers
2 x addressable LED strip headers
2 x RGB LED strip headers
6 x SATA 6Gb/s connectors
2 x M.2 Socket 3 connectors
1 x front panel header
1 x front panel audio header
1 x USB Type-C header, with USB 3.2 Gen 1 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
2 x Thunderbolt add-in card connectors
1 x serial port header
1 x Clear CMOS jumper
1 x Q-Flash Plus button
TPM (Trusted Platform Module )1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
Others
Special Features Wireless Communication module:
Intel Wi-Fi 6 AX200
Wi-Fi 802.11a/ b/ g/ n/ ac/ ax, supporting 2.4/ 5 GHz Dual-Band
BLUETOOTH 5.1
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Warranty Information
Manufacturing Warranty3 Years